Big ‘Make in India’ push! Cabinet approves four new semiconductor projects; cumulative investment of around Rs 4,600 crore eyed – check details
Prime Minister Narendra Modi-led Union Cabinet on Tuesday gave approval to four new semiconductor projects within the India Semiconductor Mission (ISM) framework. The semiconductor ecosystem in India is gaining attention, with six previously approved projects currently at different implementation stages. The approval of these projects will substantially strengthen the country’s semiconductor ecosystem, featuring the nation’s first commercial compound fabrication facility and an advanced glass-based substrate semiconductor packaging unit.These facilities will support the growing chip design capabilities emerging in the country, supported by government-provided design infrastructure to 278 academic institutions and 72 start-ups, according to the government statement.Considering the increasing semiconductor requirements in sectors such as telecom, automotive, datacentres, consumer electronics and industrial electronics, these four newly approved semiconductor projects will contribute substantially towards achieving Atmanirbhar Bharat, the release said.
India’s semiconductor plan: Top points
- The newly approved proposals come from
SiCSem ,Continental Device India Private Limited (CDIL),3D Glass Solutions Inc ., andAdvanced System in Package (ASIP) Technologies. - These four newly sanctioned proposals will establish semiconductor manufacturing units with total investments of approximately Rs 4,600 crore.
- The facilities are projected to create employment for 2,034 skilled professionals, whilst stimulating the electronic manufacturing sector, leading to additional indirect employment opportunities. Following these four new approvals, the total ISM-approved projects now stand at 10, with combined investments of about Rs.1.60 lakh crore across 6 states.
- In Odisha, two significant semiconductor facilities are being established – SiCSem and 3D Glass. CDIL operates from Punjab, while ASIP will be based in Andhra Pradesh.
- SiCSem Private Limited, in partnership with Clas-SiC Wafer Fab Ltd. from the UK, is establishing an integrated Silicon Carbide (SiC) Compound Semiconductors facility in Info Valley, Bhubaneshwar, Odisha.
- This commercial compound fab in India aims to produce Silicon Carbide devices. The facility will have the capability to manufacture 60,000 wafers annually and package 96 million units. These components will serve various sectors including Missiles, Defence equipment, Electric Vehicles (EVs), Railway, Fast Chargers, Data Centre racks, Consumer Appliances, and Solar Power Inverters.
- 3D Glass Solutions Inc. (3DGS) is developing an advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. This facility will introduce cutting-edge packaging technology to India, enhancing semiconductor industry efficiency. The unit will incorporate various advanced technologies, including glass interposers with passives and silicon bridges, alongside 3D Heterogeneous Integration (3DHI) modules.
- The annual production targets include 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules. These products will be crucial for defence, high-performance computing, artificial intelligence, RF and automotive, photonics and co-packaged optics applications.
- Advanced System in Package Technologies (ASIP) will establish a semiconductor production facility in Andhra Pradesh, collaborating with APACT Co. Ltd, South Korea. The facility will have a yearly output of 96 Million units. The products will be utilised in mobile phones, set-top boxes, automotive components, and various electronic devices.
- Continental Device (CDIL) plans to enhance its discrete semiconductor manufacturing unit in Mohali, Punjab. The facility will produce high-power discrete semiconductor components including MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors, using both Silicon and Silicon Carbide.
- The brownfield expansion aims to achieve an annual production of 158.38 million units. These components will be essential for automotive electronics, including EVs and charging infrastructure, renewable energy systems, power conversion applications, industrial uses and communication infrastructure.
